Senior Process Engineer Lithography (Multiple Positions)

Taiwan Semiconductor Manufacturing Company • Phoenix, AZ • 1h ago

This job was posted by https://www.azjobconnection.gov : For more information, please see: https://www.azjobconnection.gov/jobs/7477805

Senior Process Engineer Lithography (Multiple Positions), TSMC Arizona Corporation, Phoenix, AZ. Conduct wafer fabrication photolithography including new process development, integration, and process improvement. Lead the design and execution of experiments, interpreting and extracting insightful results from complex data sets to optimize the manufacturing process and achieve precision control at atomic levels. Apply statistical process control methods to establish and sustain a robust manufacturing process. Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality. Serve as a lead point of contact with equipment and material suppliers and partners to identify technology gaps and deficiencies; devise, evaluate and qualify mitigation and continuous improvement solutions.

40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.

MINIMUM REQUIREMENTS:

Must have a Masters degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field, and 1 year of engineering experience.

Alternatively, will accept a Bachelors degree or foreign equivalent in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science or a related field and 3 years of engineering experience.

Must have 1 year of experience in at least 2 of the following: Design of Experiment (DOE); semiconductor fabrication; statistical process control; or statistical methods for modeling multivariate data sets.

Must have 1 year of experience in at least 1 of the following metrology used in semiconductor processing: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).

Must have 1 year of experience in at least 5 of the following semiconductor photolithography tools or processes: N4 and N5 IC manufacturing process; DUV Photolithography 193nm and 248nm (ASML Twinscan Scanners); 193nm immersion multiple patterning processes including litho-etch-litho-etch (LELE) and self-aligned double patterning (SADP); JMP (statistical analysis software); ASML Yield Star; Overlay modeling, alignment, optics and focus control for semiconductor lithography; Defect Source Investigation; 6-Sigma FAB EHS (Environment, Health and Safety); or Photoresists.

Must have 1 year of experience in at least 2 of the following advance control in scanner: CD (critical dimension) APC; DOMA (Dose mapper); GridMa (Grid mapper); ProVision; Agile (AirGauge Improved LEveling); cASCAL (computational Application Specific (lens heating) CALibration); TopRC (TOP Reticle Control); FlexRay: unlimited flexibility and control to shrink; or Flexwave.

Please apply athttps://tsmcaz.info/5427LNK.

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