Low-Temperature Bonding Engineer

Global Foundries • Essex Junction, VT • 18h ago

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Job Summary

GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part of our Quantum Advanced Packaging team . This role will entail enabling next-generation assembly scaling development efforts in our Advanced Packaging and Photonics Center (APPC) as well as with our partners . The primary responsibility of this position is to develop low-temperature bonding processes, support advanced die assembly technologies, and associated assembly equipment. The engineer will drive process characterization, tool optimization, defect reduction, and integration activities required to support next-generation superconducting and cryogenic quantum packaging platforms.

Essential Responsibilities

Develop and optimize low-temperature bonding processes for quantum packaging applications.

Support assembly process development (In bonding, superconducting metal bonding, thermo-compression bonding, hybrid bonding, etc.)

Characterize bond quality, electrical performance, mechanical integrity, and reliability through cryogenic operating conditions.

Define process windows and critical-to-quality parameters for production-worthy assembly processes.

Own assembly process modules from development through qualification.

Execute process experiments and DOE activities to improve process capability and robustness.

Work with test and systems teams to ensure assembled hardware meets:

Cryogenic reliability across thermal cycles

Electrical and RF/microwave integrity requirements

Work with equipment teams to define requirements for:

High-precision alignment / bonding tools

Cryogenic-compatible materials handling

Develop deep understanding of tool capability vs. quantum packaging requirements.

Contribute to APPC / Quantum packaging roadmap and capability build-out.

Provide clear technical updates, data analysis, and reports to stakeholders.

Support IP generation, publications, and conference contributions.

Other Responsibilities: ?

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.?

Take part in hiring of other Advanced Packaging team members.?

Mentor and guide new hires to assume their roles and responsibilities.?

Other duties as assigned by manager .?

Required Qualifications: ?

Education - Bachelor's in Electrical Engineering , Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.?

BS degree with at least 4 years of prior related work experience.?

In depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.

Strong problem solving and technical trouble shooting skills including expertise in design of experiment.

Must have at least an overall 3.0 GPA and proven good academic standing.?

Language Fluency - English (Written & Verbal).?

Travel - Up to 10%.?

Preferred Qualifications: ?

Education - MS education level preferred with at least 2 years of prior related work experience. ?

Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.??

Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.???

Strong written and verbal communication skills . ???

Strong planning & organizational skills.?

Expected Salary Range

$85,000.00 - $146,000.00

The exact Salary will be determined based on qualifications, experience and location.

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