Job Description: Mechanical Engineer - Principal Electromechanical Engineering (Electronic Packaging & Payload Systems)
This senior-level Principal Electromechanical Engineering role focuses on leading the design and integration of electronic packaging and payload systems, with an emphasis on circuit card assembly (CCA) packaging, payload electronics, and subsystem integration. The Mechanical Engineer provides strategic technical direction, drives innovation in electromechanical design, and delivers hands-on expertise across multiple complex engineering programs. This position plays a key leadership role in ensuring that payload electronic control assemblies and subsystem hardware meet structural, thermal, and mechanical performance requirements while supporting program objectives.
Responsibilities
Lead the development and execution of mechanical and electromechanical design solutions for payload electronic control assemblies (ECAs) and subsystem hardware.
Oversee mechanical requirements analysis for complex engineering programs and define technical strategies that align with program and system-level objectives.
Ensure designs comply with structural, thermal, and mechanical requirements through detailed reviews, structural analysis, and thermal analysis.
Provide technical leadership and mentorship to cross-functional engineering teams, fostering collaboration and knowledge sharing.
Lead formal design reviews and support risk identification, assessment, and mitigation activities throughout the product lifecycle.
Develop, review, and approve mechanical drawings, engineering documentation, and test fixtures to support development, verification, and production.
Collaborate closely with procurement teams and external vendors to source materials and components that meet design, cost, and schedule targets.
Support hardware integration, testing, and validation activities across multiple programs, ensuring successful subsystem and payload integration.
Drive continuous improvement initiatives and promote best practices in electromechanical engineering, electronic packaging, and subsystem design.
Apply expertise in electronic packaging, circuit card assembly (CCA) packaging, and payload integration to optimize performance, reliability, and manufacturability.
Coordinate with multidisciplinary stakeholders to interpret complex requirements and translate them into robust, practical design solutions.
Contribute to and support formal engineering release and documentation processes to maintain configuration control and product integrity.
Essential Skills
Bachelor's degree in Mechanical Engineering or a related engineering field.
Typically 5+ years of experience in electromechanical system design.
Strong expertise in electronic packaging, including circuit card assembly (CCA) packaging and payload electronic control assemblies.
Proven experience in structural analysis and structural integrity assessment for mechanical and electromechanical systems.
Demonstrated proficiency in thermal analysis for electronic packaging and payload systems.
Ability to interpret complex technical and program requirements and translate them into effective mechanical and electromechanical design solutions.
Experience working within cross-functional engineering teams and program-driven environments.
Strong communication and collaboration skills to effectively interface with engineering, procurement, vendors, and program stakeholders.
Ability to obtain and maintain a TS/SCI security clearance with polygraph.
U.S. citizenship (required for security clearance eligibility).
Additional Skills & Qualifications
Advanced degree in Mechanical Engineering or a related field (may substitute for a portion of required experience).
Active TS/SCI security clearance with polygraph.
Extensive experience in electronic packaging and payload integration, preferably within aerospace or defense environments.
Proficiency with NX or similar CAD tools for mechanical and electromechanical design.
Experience with MPLM systems and formal engineering release processes.
Familiarity with formal engineering documentation practices, including configuration management and controlled drawing release.
Demonstrated success leading multi-disciplinary engineering teams in fast-paced program environments.
Experience developing and approving engineering documentation and test fixtures for electronic and electromechanical systems.
Experience in aerospace or defense industry applications involving payload electronics, subsystem design, and electronic control assemblies.
Experience supporting risk identification, assessment, and mitigation in complex engineering programs.
Job Type & Location
This is a Contract to Hire position based out of Palatine, IL.
Pay and Benefits
The pay range for this position is $48.00 - $57.00/hr.
Eligibility requirements apply to some benefits and may depend on your job classification and length of employment. Benefits are subject to change and may be subject to specific elections, plan, or program terms. If eligible, the benefits available for this temporary role may include the following: - Medical, dental & vision - Critical Illness, Accident, and Hospital - 401(k) Retirement Plan - Pre-tax and Roth post-tax contributions available - Life Insurance (Voluntary Life & AD&D for the employee and dependents) - Short and long-term disability - Health Spending Account (HSA) - Transportation benefits - Employee Assistance Program - Time Off/Leave (PTO, Vacation or Sick Leave)
Workplace Type
This is a fully onsite position in Palatine,IL.
Application Deadline
This position is anticipated to close on Jul 8, 2026.
About Actalent
Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.
The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.
If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email actalentaccommodation@actalentservices.com for other accommodation options.
San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.
Massachusetts Lie Detector: It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.
Use of Artificial Intelligence (AI): We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.
