Job Details:
Job Description:
Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below.
Life at Intel (https://jobs.intel.com/en/life-at-intel)
We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing.
This role requires regular onsite presence to fulfill essential job responsibilities .
The Research Engineer will:
Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.
The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids.
The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems.
The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches.
The ideal candidate should exhibit the following skills or behavioral traits:
Demonstrated ability to work seamlessly between experiments and simulations.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics.
3+ years of Thermal-mechanical work/research experience with emphasis on silicon reliability
3+ years of experience with Finite Element Analysis tools
3+ years of experience with experimental material characterization metrologies such as DMA/TMA and nano-indentation.
Preferred Qualifications:
Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
Experience with designing, planning and executing experiments, along with interpretation of results.
Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
Programming/script development with artificial intelligence and machine learning concepts.
Previous related work experience in a semiconductor foundry preferred.
Benefits at Intel
Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits | Intel Careers (https://jobs.intel.com/en/benefits) for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, Oregon, Hillsboro
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel (https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003) .
Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time @type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
