Job Details:
Job Description:
The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.
As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Intel Foundry, a fully vertical, stand-alone foundry business, reporting directly to the CEO. Intel Foundry will be a world-class foundry business and major provider of US based capacity to serve customers globally.
Foundry Services is already engaged with customers today starting with our existing foundry offerings. We are expanding at a torrid pace to include our most advanced technologies, which are ideal for high-performance applications, and they are completely dedicated to the success of its customers with full profit and loss responsibilities. Using this model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments.
Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IP's.
Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.
The Advanced IC Packaging Software Engineer will work closely with Intel foundry customers on advanced packaging technologies to define, develop, and implement design tools, flows, automation and methodologies for system co-design, design implementation, and verification.
Will serve as the technical expert on design tools as well as consult on design and implementation issues.
Utilizes modern software development methodologies, programming languages, domain knowledge, and secure coding practices to design, develop, debug, and/or validate algorithms, software tools, and systems that enable our internal/external engineering partners to design/manufacture intel silicon, integrate Intel silicon and/or software into impactful products.
The ideal candidate should exhibit the following behavioral traits:
Self-driven and results-oriented and able to multi-task and work in a fast-paced worldwide environment.
Analytical problem-solving skills.
Effective communication skills and experience in collaborating with stakeholders and customers.
Qualifications:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
Bachelor's Degree in Computer Science, Electrical engineering or related degrees in Computer Engineering, Software Development, Software Engineering or related discipline and 2+ years of relevant experience
Master's Degree in Computer Science, Electrical engineering or related degrees in Computer Engineering, Software Development, Software Engineering or related discipline and 1+ years of relevant experience
Preferred Qualifications:
Experience with C/C++ with STL and Boost libraries
Data structures and algorithms
Computational Geometry
Experience with EDA Tools such as Cadence Integrity, Siemens Innovator 3D, Cadence Advanced Package Designer, Siemens Mentor Xpedition
Software design and architecture
Scripting experience in tcl, Python, SKILL, VBScript, or Perl
Understanding of AI and ML fundamentals
Experience with Agile and Scrum development practices
Previous related work experience in a semiconductor foundry preferred
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US: $109,070.00-206,860.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time @type) are subject to change.
