Req ID: 138372
Region: Americas
Country: USA
State/Province: Texas
City: Richardson
General Overview
Job Title: Director, Manufacturing and Test Engineering 2
Functional Area: Engineering (ENG)
Career Stream: Engineering (ENG)
Role: Director 2 (DR2)
Job Code: DR2-ENG-MFTS
Job Band: 13
Direct/Indirect Indicator: Indirect
Summary
Celestica is looking for a dynamic, high-velocity Director of Manufacturing and Test Engineering to lead our Advanced Engineering and Process Development teams.
This is a critical leadership role responsible for bridging the gap between cutting-edge product technology roadmaps and full-scale manufacturing execution. While our product design teams define what we make, your team will design, optimize, and deploy the advanced processes and equipment required to build it.
This position is a key succession-role located in Richardson, TX , tasked with expanding our regional manufacturing footprint (including Fort Worth and Austin) and driving global standardizations with our high-volume manufacturing bases, such as Thailand. The ideal candidate brings deep technical knowledge in semiconductors, advanced packaging, and PCBs, combined with an assertive, execution-oriented leadership style capable of matching the rapid life cycles of the AI-driven tech market.
Key Responsibilities
Advanced Process & Equipment Development: Identify, scope, and manage customer-specific process and equipment development projects from concept to full production launch. Break physical and manufacturing barriers to deliver next-generation AI-enabling hardware.
DFX & Collaboration: Partner closely with internal Product Design groups (HPS) and external customers early in the design phase. Evaluate, optimize, and negotiate tradeoffs for Design for Manufacturability (DFM), Assembly (DFA), and Test (DFT) to deliver cost-optimized, flawless manufacturing solutions.
Thermal & Material Innovation Execution: Oversee Subject Matter Experts (SMEs) focused on high-power ASIC thermal modeling, liquid Thermal Interface Materials (TIM) application, signal integrity (CPO/Chip Package Optics), and material science interactions (micro-level pitch spacing, advanced soldering).
System Integration Growth (L11/L12): Drive manufacturing and test strategies tailored for large, complex Level 11 (L11) integration and next-generation rack-level solutions.
Operational Excellence & Urgency: Instill a strong culture of accountability and velocity. Transform development timelines from traditional 12-month cycles down to aggressive 5-to-9-month windows without sacrificing quality or safety.
Global Standards & Succession: Manage the phased talent transition and succession planning for retiring legacy teams. Establish best practice standards, provide global application support, and build out the Greater Dallas engineering hub.
Knowledge/Skills/Competencies
Technical Competencies
Semiconductor & Advanced Packaging Expertise: Deep understanding of large ASIC packages, silicon thermal dynamics, substrate warpage, coefficient of thermal expansion (CTE), and tight-pitch PCB manufacturing.
Advanced Thermal Management: Familiarity with high-power cooling methodologies, thermal dissipation modeling, and liquid/pre-formed thermal interface materials.
Testing Methodologies: Exposure to complex test architectures, including elevated temperature burn-in testers, functional testing, and optimizing capex/environmental footprints for test spaces.
Leadership & Enabling Competencies
Velocity-Driven Leadership: A proven track record of driving projects with an intense sense of urgency. Ability to move teams past a "lab/academic" mindset into fast-paced commercial execution.
Project & Financial Management: Ability to lead high-value, multi-functional engineering projects with direct accountability to executive leadership. Strong financial acumen to ensure engineering delivery meets required ROI and benchmarking goals.
Assertive Stakeholder Management: Excellent negotiation and presentation skills to effectively manage relationships with Tier 1 hyperscale customers, suppliers, and internal global site leaders.
Typical Experience
Experience: 15+ years of relevant engineering leadership experience within semiconductor, advanced electronic assembly, or hardware manufacturing environments.
Typical Education
Education: Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, or an equivalent combination of education and experience.
Physical Demands
Environment: Standard office and advanced manufacturing lab environment.
Travel: Up to 25% travel (domestic and international), including key sites like San Jose, California and Thailand.
Notes
This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.
Celestica is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, pregnancy, genetic information, disability, status as a protected veteran, or any other protected category under applicable federal, state, and local laws.
This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment and also states that retaliation against a person who files a charge of discrimination, participates in a discrimination proceeding, or otherwise opposes an unlawful employment practice will not be tolerated. All information will be kept confidential according to EEO guidelines.
Celestica is an E-Verify employer.
COMPANY OVERVIEW:
Celestica, Inc. (NYSE: CLS; TSX: CLS) is a technology leader dedicated to driving customer success and market advancements. With deep expertise in design, engineering, manufacturing, supply chain, and platform solutions, Celestica enables critical data center infrastructure for AI, cloud, and hybrid cloud and advances technologies in high-growth markets. With a talented team and a strategic global network, Celestica helps its customers achieve competitive advantages.
Today, Celestica delivers innovative supply chain solutions globally to customers in strategic two operating and reporting segments: Advanced Technology Solutions (ATS) and Connectivity and Cloud Solutions (CC):
ATS: This segment serves customers in complex, regulated and high-reliability markets such as Industrial & Smart Energy, Aerospace & Defense, Semiconductor Capital Equipment, and HealthTech. It is engineering led, with deep expertise in design, manufacturing and lifecycle solutions.
CCS: This segment focuses on high-performance technology solutions and services for the data center, serving hyperscalers, digital native customers and enterprises. Celestica's Platform Solutions offering provides innovative and customizable computing, storage and networking solutions enabling AI-driven growth.
Built on a legacy of trust and performance, Celestica has earned its reputation by delivering results in complex and fast-changing markets. Celestica exceeds customer expectations by identifying trends and staying ahead of the curve. Backed by comprehensive capabilities and a global network across North America, Europe and Asia, Celestica helps customers gain competitive advantage with the quality, flexibility and resiliency they need to respond quickly to shifts in demand. Guided by a bold vision to accelerate market advancements, Celestica delivers innovative solutions and technologies that turn complexity into opportunity. Anchored in teamwork and commitment, Celestica strives to be the most trusted partner to its customers and colleagues worldwide.
Celestica would like to thank all applicants, however, only qualified applicants will be contacted.
Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.
