About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Summary of Role: The CMOS product team is seeking an experienced program manager with strong semiconductor process integration expertise to join our growing Advanced Packaging team in the U.S., preferably in Malta, NY. This role will lead cross-functional technology and product development programs that enable new advanced packaging features and offerings on FinFET and FDSOI base technologies, from early process demonstration through qualification and manufacturing transfer. Areas of focus include 2.5D and 3D heterogeneous integration solutions involving hybrid bonding, fusion bonding, die-to-wafer and wafer-to-wafer integration, TSV, deep trench capacitor integration, dicing, interposer-related integration, and package-process co-optimization in support of the full CMOS product portfolio.
Essential Responsibilities:
Serve as the program manager for advanced packaging technology development programs supporting GLOBALFOUNDRIES' expanding U.S. advanced packaging capabilities.
Plan and drive execution of complex semiconductor technology development programs with clear milestones, deliverables, critical path management, and cross-functional dependencies.
Own the overall program schedule, resource planning, milestone alignment, and execution readiness across technical workstreams.
Partner with process integration leaders to define development flows, establish committed execution plans, run hardware, and achieve technical figures of merit, yield, and reliability targets.
Ensure seamless transition from development through qualification into manufacturing transfer and production readiness.
Lead cross-functional teams across integration, module development, manufacturing, product engineering, PDK, modeling, IP, quality, and operations to define work packages and deliver programs on time and with high quality.
Work closely with Product Marketing, PMO, PDK, Modeling, IP, manufacturing, and external partners to align technical objectives, schedules, and customer requirements.
Communicate effectively with internal and external stakeholders, including customers and executive leadership, to provide program status, manage escalations, align priorities, and drive decisions.
Prepare clear technical and executive-level presentations, status reviews, and customer updates, including risk assessments, mitigation plans, and decision summaries.
Support additional cross-functional initiatives, continuous improvement activities, and strategic assignments as needed.
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Travel
Required Qualifications:
Strong working knowledge of modern CMOS process integration and semiconductor technology development.
Demonstrated ability to work effectively in cross-functional teams, with strong written and verbal communication skills in English.
Strong analytical, problem-solving, and project/program management skills, including risk management, issue resolution, and dependency tracking.
Several years of experience in technical leadership roles within the semiconductor industry, preferably in advanced packaging, process integration, or technology development.
Proven track record in technology development and/or program management of complex, cross-functional engineering programs from concept through manufacturing transfer.
Experience with semiconductor volume manufacturing, statistical methods, FMEA/8D methodology, and customer-facing work in multicultural environments is highly desirable.
Advanced packaging experience is preferred, including exposure to TSV, hybrid bonding, fusion bonding, die-to-wafer integration, wafer-to-wafer integration, heterogeneous integration, interposer integration, and related module development.
Master's degree, Diploma degree, or Ph.D. in Engineering or Science (for example Physics, Chemistry, Materials Science, Electrical Engineering, or related fields) from an accredited university.
Additional professional experience in advanced module development, process integration, and/or advanced packaging technology development:
B.S. + minimum of 15+ years of relevant experience
M.S. + minimum of 10 of relevant experience
Ph.D. + minimum of 8 of relevant experience
Hands-on familiarity with semiconductor integration practices including lot handling, DOE, inline/HOL/ET analysis, monitoring, yield learning, and data-driven problem solving. Strong coordination skills across departments and geographies, with a proactive and collaborative mindset.
Preferred Qualifications:
Strong technical program management skills, including the ability to navigate ambiguity, manage risk, align stakeholders, and drive programs through execution to completion.
Experience in advanced packaging integration is a plus, including TSV, 2.5D/3D integration, hybrid bonding, fusion bonding, chiplet integration, or related heterogeneous integration technologies.
Project management certification (for example PMP or IPMA) is a plus.
Strong written and verbal communication skills, including the ability to present technical content clearly to executive and customer audiences.
Strong planning, organizational, and execution skills with a disciplined approach to action tracking, milestone closure, and continuous improvement.
Expected Salary Range
$143,000.00 - $247,000.00
The exact Salary will be determined based on qualifications, experience and location.
The role you are applying for may require you to obtain a US Department of Defense Security Clearance at some time during your employment. Acceptance of this role commits to applying for such if requested. Further, the applicant consents to being asked questions about their citizenship and background to assess the likelihood of obtaining a Security Clearance. The applicant also acknowledges that GlobalFoundries can only nominate and submit an application for a Security Clearance. The granting of a Security Clearance is at the sole discretion of the U.S. Government and the Department of Defense.
If you need a reasonable accommodation for any part of the employment process, please contact us by email at usaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.
An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.
GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.
All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law
