[Design, implementation and verification of cooling systems and mechanical packaging for high-power electronic equipment used in broadcast transmission applications. ]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[Cooling systems designed will employ various state-of-the-art methods, including liquid and air coolants, passive and active circulation, high fin-density heat sink technologies, vapor-phase, and others. ]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[Analysis and design tools used include Flow Simulation, SolidWorks FEA/CFD, SolidWorks, DraftSight, MS Excel, etc. ]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[Additional responsibilities include packaging design of transmitter systems and subsystems, along with the creation and maintenance of Bills of Materials.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[Interface and communicate with teams in an effective and organized, verbal and written manner. ]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[Will work effectively with cross-functional team members to meet challenging schedule, technical and cost objectives.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

Qualifications:

[Bachelor's degree in mechanical engineering and 5+ years experience in mechanical engineering with specific preference given to electronics packaging.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[5 years knowledge of thermal and mechanical packaging engineering concepts used in electronic equipment design.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[5 years experience with air cooling, liquid cooling and associated test methods.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[5 years experience creating mechanical assemblies from design concepts and inputs, along with knowledge of DFM/DFT, sheet metal fabrication, mechanical hardware, and documentation systems.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[3 years knowledge of and experience with materials (properties, strengths, compatibility, etc.) used in cooling systems and mechanical packaging.]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

[3 years experience using numerical thermal analysis tools (CFD, FEA, FNM, etc.), 3D CAD (SolidWorks preferred), and standard PC tools (Microsoft Office).]{verdana",="" sans-serif;="" font-size:="" 11pt"=""}

GatesAir

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Mechanical Design Engineer